BYCHIPS is the stocking distributor for ARA39D104KGS, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ARA39D104KGS by email, we will give you a best price according your plan.
Buy ARA39D104KGS with BYCHPS
Buy with guarantee
ARA39D104KGS
- Part Number:
- ARA39D104KGS
- Manufacturer:
- KEMET
- Description:
- CAP CER 0.1UF 100V X7R AXIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13285 Pieces
- Data sheet:
- ARA39D104KGS.pdf
Introduction
Specifications
| Voltage - Rated: | 100V |
|---|---|
| Tolerance: | ±10% |
| Thickness (Max): | - |
| Temperature Coefficient: | X7R |
| Size / Dimension: | 0.150" Square x 0.400" L (3.81mm x 10.16mm) |
| Series: | ARA |
| Ratings: | - |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Operating Temperature: | -55°C ~ 200°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 21 Weeks |
| Manufacturer Part Number: | ARA39D104KGS |
| Lead Style: | Straight |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | High Temperature |
| Failure Rate: | - |
| Expanded Description: | 0.1µF ±10% 100V Ceramic Capacitor X7R Axial |
| Description: | CAP CER 0.1UF 100V X7R AXIAL |
| Capacitance: | 0.1µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for ARA39D104KGS
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers