BYCHIPS is the stocking distributor for APTGT50DA170T1G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for APTGT50DA170T1G by email, we will give you a best price according your plan.
Buy APTGT50DA170T1G with BYCHPS
Buy with guarantee
APTGT50DA170T1G
- Part Number:
- APTGT50DA170T1G
- Manufacturer:
- Microsemi
- Description:
- IGBT 1700V 75A 312W SP1
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18389 Pieces
- Data sheet:
- 1.APTGT50DA170T1G.pdf2.APTGT50DA170T1G.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 1700V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 2.4V @ 15V, 50A |
| Supplier Device Package: | SP1 |
| Series: | - |
| Power - Max: | 312W |
| Package / Case: | SP1 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | Yes |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 22 Weeks |
| Manufacturer Part Number: | APTGT50DA170T1G |
| Input Capacitance (Cies) @ Vce: | 4.4nF @ 25V |
| Input: | Standard |
| IGBT Type: | Trench Field Stop |
| Expanded Description: | IGBT Module Trench Field Stop Single 1700V 75A 312W Chassis Mount SP1 |
| Description: | IGBT 1700V 75A 312W SP1 |
| Current - Collector Cutoff (Max): | 250µA |
| Current - Collector (Ic) (Max): | 75A |
| Configuration: | Single |
| Email: | [email protected] |
Related parts for APTGT50DA170T1G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers