BYCHIPS is the stocking distributor for ALS70C512LM400, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ALS70C512LM400 by email, we will give you a best price according your plan.
Buy ALS70C512LM400 with BYCHPS
Buy with guarantee
ALS70C512LM400
- Part Number:
- ALS70C512LM400
- Manufacturer:
- KEMET
- Description:
- ALU SCREW TERMINAL 5100UF 400V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19516 Pieces
- Data sheet:
- ALS70C512LM400.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | ALS70C512LM400 |
| Expanded Description: | Aluminum Capacitors |
| Description: | ALU SCREW TERMINAL 5100UF 400V |
| Email: | [email protected] |
Related parts for ALS70C512LM400
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ALS70C512QC350 | KEMET | ALU SCREW TERMINAL 5100UF 350V | Inquiry |
|
ALS70C564QH025 | KEMET | ALU SCREW TERMINAL 560000UF 25V | Inquiry |
|
ALS70C564NP025 | KEMET | ALU SCREW TERMINAL 560000UF 25V | Inquiry |
|
ALS70C562LM350 | KEMET | ALU SCREW TERMINAL 5600UF 350V | Inquiry |
|
ALS70C512NJ500 | KEMET | ALU SCREW TERMINAL 5100UF 500V | Inquiry |
|
ALS70C564QW040 | KEMET | ALU SCREW TERMINAL 560000UF 40V | Inquiry |
|
ALS70C512MF400 | KEMET | ALU SCREW TERMINAL 5100UF 400V | Inquiry |
|
ALS70C512NP550 | KEMET | ALU SCREW TERMINAL 5100UF 550V | Inquiry |
|
ALS70C562QH500 | KEMET | ALU SCREW TERMINAL 5600UF 500V | Inquiry |
|
ALS70C513NF100 | KEMET | ALU SCREW TERMINAL 51000UF 100V | Inquiry |
|
ALS70C513NJ100 | KEMET | ALU SCREW TERMINAL 51000UF 100V | Inquiry |
|
ALS70C514NS040 | KEMET | ALU SCREW TERMINAL 510000UF 40V | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers