BYCHIPS is the stocking distributor for AFE7225IRGC25, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for AFE7225IRGC25 by email, we will give you a best price according your plan.
Buy AFE7225IRGC25 with BYCHPS
Buy with guarantee
AFE7225IRGC25
- Part Number:
- AFE7225IRGC25
- Manufacturer:
- Description:
- IC AFE 12BIT 125/250MSPS 64VQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18797 Pieces
- Data sheet:
- AFE7225IRGC25.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 1.7 V ~ 1.9 V |
|---|---|
| Voltage - Supply, Analog: | 2.85 V ~ 3.6 V |
| Supplier Device Package: | 64-VQFN (9x9) |
| Series: | - |
| Power (Watts): | 650mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 64-VFQFN Exposed Pad |
| Other Names: | 296-30112-2 |
| Number of Channels: | 4 |
| Number of Bits: | 12 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | AFE7225IRGC25 |
| Expanded Description: | 4 Channel AFE 12 Bit 650mW 64-VQFN (9x9) |
| Description: | IC AFE 12BIT 125/250MSPS 64VQFN |
| Email: | [email protected] |
Related parts for AFE7225IRGC25
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
ADS1191IRSMT | Texas Instruments | IC AFE 16BIT 8KSPS 1CH 32VQFN | Inquiry |
|
AFE7225IRGCT | Texas Instruments | IC AFE 12BIT 125/250MSPS 64VQFN | Inquiry |
|
AFE7225IRGCR | Texas Instruments | IC AFE 12BIT 125/250MSPS 64VQFN | Inquiry |
|
AFE7222IRGCT | Texas Instruments | IC AFE 12BIT 65/130MSPS 64VQFN | Inquiry |
|
AFE7222IRGC25 | Texas Instruments | IC AFE 12BIT 65/130MSPS 64VQFN | Inquiry |
|
AFE7222IRGCR | Texas Instruments | IC AFE 12BIT 65/130MSPS 64VQFN | Inquiry |
 |
TC514COI | Microchip Technology | IC ANALOG FRONT END 17BIT 28SOIC | Inquiry |
 |
TC500ACOE | Microchip Technology | IC ANALOG FRONT END 17BIT 16SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers