BYCHIPS is the stocking distributor for ADSP-BF537KBCZ-6BV, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ADSP-BF537KBCZ-6BV by email, we will give you a best price according your plan.
Buy ADSP-BF537KBCZ-6BV with BYCHPS
Buy with guarantee
ADSP-BF537KBCZ-6BV
- Part Number:
- ADSP-BF537KBCZ-6BV
- Manufacturer:
- AD
- Description:
- IC DSP CTLR 16BIT 208CSBGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15668 Pieces
Introduction
Specifications
| Voltage - I/O: | 3.30V |
|---|---|
| Voltage - Core: | 1.30V |
| Type: | Fixed Point |
| Supplier Device Package: | 208-CSPBGA (17x17) |
| Series: | Blackfin® |
| Packaging: | Tray |
| Package / Case: | 208-FBGA, CSPBGA |
| Other Names: | ADSPBF537KBCZ6BV |
| Operating Temperature: | 0°C ~ 70°C (TA) |
| On-Chip RAM: | 132kB |
| Non-Volatile Memory: | External |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | ADSP-BF537KBCZ-6BV |
| Interface: | CAN, SPI, SSP, TWI, UART |
| Description: | IC DSP CTLR 16BIT 208CSBGA |
| Clock Rate: | 600MHz |
| Email: | [email protected] |
Related parts for ADSP-BF537KBCZ-6BV
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers