BYCHIPS is the stocking distributor for ADG5209FBCPZ-RL7, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ADG5209FBCPZ-RL7 by email, we will give you a best price according your plan.
Buy ADG5209FBCPZ-RL7 with BYCHPS
Buy with guarantee
ADG5209FBCPZ-RL7
- Part Number:
- ADG5209FBCPZ-RL7
- Manufacturer:
- AD
- Description:
- IC MULTIPLEXER 4CH
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17856 Pieces
- Data sheet:
- ADG5209FBCPZ-RL7.pdf
Introduction
Specifications
| Voltage - Supply, Single (V+): | 9 V ~ 40 V |
|---|---|
| Voltage - Supply, Dual (V±): | ±9 V ~ 22 V |
| Switch Time (Ton, Toff) (Max): | 140ns, 185ns |
| Switch Circuit: | SP4T |
| Supplier Device Package: | 16-LFCSP (4x4) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-WQFN Exposed Pad, CSP |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| On-State Resistance (Max): | 160 Ohm |
| Number of Circuits: | 2 |
| Multiplexer/Demultiplexer Circuit: | 4:1 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | ADG5209FBCPZ-RL7 |
| Expanded Description: | 2 Circuit IC Switch 4:1 160 Ohm 16-LFCSP (4x4) |
| Description: | IC MULTIPLEXER 4CH |
| Current - Leakage (IS(off)) (Max): | 1nA |
| Crosstalk: | - |
| Charge Injection: | 0.4pC |
| Channel-to-Channel Matching (ΔRon): | 3.5 Ohm |
| Channel Capacitance (CS(off), CD(off)): | 4pF, 8pF |
| -3db Bandwidth: | 130MHz |
| Email: | [email protected] |
Related parts for ADG5209FBCPZ-RL7
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers