BYCHIPS is the stocking distributor for ADCMP607BCPZ-R2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ADCMP607BCPZ-R2 by email, we will give you a best price according your plan.
Buy ADCMP607BCPZ-R2 with BYCHPS
Buy with guarantee
ADCMP607BCPZ-R2
- Part Number:
- ADCMP607BCPZ-R2
- Manufacturer:
- AD
- Description:
- IC COMP TTL/CMOS 1CHAN 12-LFCSP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19375 Pieces
- Data sheet:
- ADCMP607BCPZ-R2.pdf
Introduction
Specifications
| Voltage - Supply, Single/Dual (±): | 2.5 V ~ 5.5 V |
|---|---|
| Voltage - Input Offset (Max): | 5mV @ 2.5V |
| Type: | with Latch |
| Supplier Device Package: | 12-LFCSP-WQ (3x3) |
| Series: | - |
| Propagation Delay (Max): | 2.1ns |
| Packaging: | Original-Reel® |
| Package / Case: | 12-WFQFN Exposed Pad, CSP |
| Output Type: | CML, Complementary, Rail-to-Rail |
| Other Names: | ADCMP607BCPZ-R2DKR |
| Operating Temperature: | -40°C ~ 125°C |
| Number of Elements: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | ADCMP607BCPZ-R2 |
| Hysteresis: | 100µV |
| Expanded Description: | Comparator with Latch CML, Complementary, Rail-to-Rail 12-LFCSP-WQ (3x3) |
| Description: | IC COMP TTL/CMOS 1CHAN 12-LFCSP |
| Current - Quiescent (Max): | 1.5mA |
| Current - Output (Typ): | 50mA |
| Current - Input Bias (Max): | 5µA @ 2.5V |
| CMRR, PSRR (Typ): | 50dB CMRR, 50dB PSRR |
| Email: | [email protected] |
Related parts for ADCMP607BCPZ-R2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers