BYCHIPS is the stocking distributor for ACB1608M-080-T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for ACB1608M-080-T by email, we will give you a best price according your plan.
Buy ACB1608M-080-T with BYCHPS
Buy with guarantee
ACB1608M-080-T
- Part Number:
- ACB1608M-080-T
- Manufacturer:
- TDK Corporation
- Description:
- FERRITE BEAD 80 OHM 0603 1LN
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 16510 Pieces
- Data sheet:
- ACB1608M-080-T.pdf
Introduction
Specifications
| Size / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
|---|---|
| Series: | ACB |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0603 (1608 Metric) |
| Operating Temperature: | - |
| Number of Lines: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | ACB1608M-080-T |
| Impedance @ Frequency: | 80 Ohm @ 100MHz |
| Height (Max): | 0.043" (1.10mm) |
| Filter Type: | Signal Line |
| Description: | FERRITE BEAD 80 OHM 0603 1LN |
| DC Resistance (DCR) (Max): | 500 mOhm |
| Current Rating (Max): | 300mA |
| Email: | [email protected] |
Related parts for ACB1608M-080-T
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ACB1608L-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0603 1LN | Inquiry |
|
ACB1608H-060-T | TDK Corporation | FERRITE BEAD 60 OHM 0603 1LN | Inquiry |
|
ACB1608M-040-T | TDK Corporation | FERRITE BEAD 40 OHM 0603 1LN | Inquiry |
|
ACB1608L-030-T | TDK Corporation | FERRITE BEAD 30 OHM 0603 1LN | Inquiry |
|
ACB1608L-060-T | TDK Corporation | FERRITE BEAD 60 OHM 0603 1LN | Inquiry |
|
ACB1608H-030-T | TDK Corporation | FERRITE BEAD 30 OHM 0603 1LN | Inquiry |
|
ACB1608H-015-T | TDK Corporation | FERRITE BEAD 15 OHM 0603 1LN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers