BYCHIPS is the stocking distributor for 8869620000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 8869620000 by email, we will give you a best price according your plan.
Buy 8869620000 with BYCHPS
Buy with guarantee
8869620000
- Part Number:
- 8869620000
- Manufacturer:
- Weidmuller
- Description:
- RIM-I 3 24/60VUC GN
- Lead Free Status / RoHS Status:
- Not applicable / Not applicable
- Available Quantity:
- 18491 Pieces
- Data sheet:
- 8869620000.pdf
Introduction
Specifications
| Specifications: | Green LED, 24 ~ 60VAC/DC |
|---|---|
| Series: | RIM |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | 8869620000 |
| For Use With/Related Products: | SRC Sockets |
| Expanded Description: | Module, LED and/or Protection SRC Sockets |
| Description: | RIM-I 3 24/60VUC GN |
| Color: | - |
| Accessory Type: | Module, LED and/or Protection |
| Email: | [email protected] |
Related parts for 8869620000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
8869630000 | Weidmuller | RIM-I 3 6/24VUC | Inquiry |
 |
8869650000 | Weidmuller | RIM-I 3 110/230 V UC | Inquiry |
 |
8869690000 | Weidmuller | RIM-I 2 110/230VDC | Inquiry |
 |
8869610000 | Weidmuller | RIM-I 3 24/60VUC | Inquiry |
 |
8869660000 | Weidmuller | RIM-I 3 110/230VUC GN | Inquiry |
 |
8869640000 | Weidmuller | RIM-I 3 6/24VUC GN (GREEN) | Inquiry |
 |
8869600000 | Weidmuller | RIM-I 2 6/24VDC GN | Inquiry |
 |
8869680000 | Weidmuller | RIM-I 2 24/60VDC GN | Inquiry |
 |
8869670000 | Weidmuller | RIM-I 2 24/60VDC | Inquiry |
 |
J73KN-AM-11V | Omron Automation and Safety | AUX CONT MINI 1NO 1NC LEFT | Inquiry |
 |
ATC18002 | Panasonic Industrial Automation Sales | RUBBER GASKET (50MM) FOR MULT | Inquiry |
|
J73KN-E-22F | Omron Automation and Safety | AUX CONTACT BLOCK 2NO+2NC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers