BYCHIPS is the stocking distributor for 74SSTUB32868ZRHR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74SSTUB32868ZRHR by email, we will give you a best price according your plan.
Buy 74SSTUB32868ZRHR with BYCHPS
Buy with guarantee
74SSTUB32868ZRHR
- Part Number:
- 74SSTUB32868ZRHR
- Manufacturer:
- Description:
- IC CONFIG REG BUFF 28BIT 176-BGA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19261 Pieces
- Data sheet:
- 74SSTUB32868ZRHR.pdf
Introduction
Specifications
| Supply Voltage: | 1.7 V ~ 1.9 V |
|---|---|
| Supplier Device Package: | 176-NFBGA (6x15) |
| Series: | 74SSTUB |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 176-BGA |
| Other Names: | 296-22074-2 |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Bits: | 28 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | 74SSTUB32868ZRHR |
| Logic Type: | 1:2 Configurable Registered Buffer with Parity |
| Expanded Description: | 1:2 Configurable Registered Buffer with Parity IC 176-NFBGA (6x15) |
| Description: | IC CONFIG REG BUFF 28BIT 176-BGA |
| Email: | [email protected] |
Related parts for 74SSTUB32868ZRHR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
74SSTUB32864AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Inquiry |
|
74SSTUB32866AZKER | Texas Instruments | IC CONFIG REG BUFF 25BIT 96-BGA | Inquiry |
|
74SSTUB32865AZJBR | Texas Instruments | IC REGSTR BUFF 28-56BIT 160NFBGA | Inquiry |
|
74SSTUB32865ZJBR | Texas Instruments | IC REGISTERED BUFFER 160-TFBGA | Inquiry |
|
74SSTUB32868AZRHR | Texas Instruments | IC REGSTR BUFFER 28-56BIT 176BGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers