BYCHIPS is the stocking distributor for 74LVCU04APW-Q100J, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74LVCU04APW-Q100J by email, we will give you a best price according your plan.
Buy 74LVCU04APW-Q100J with BYCHPS
Buy with guarantee
74LVCU04APW-Q100J
- Part Number:
- 74LVCU04APW-Q100J
- Manufacturer:
- Nexperia
- Description:
- IC HEX INVERTER 14TSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19810 Pieces
- Data sheet:
- 74LVCU04APW-Q100J.pdf
Introduction
Specifications
| Supplier Device Package: | 14-TSSOP |
|---|---|
| Series: | 74LVCU |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 14-TSSOP (0.173", 4.40mm Width) |
| Other Names: | 935304499118 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | 74LVCU04APW-Q100J |
| Expanded Description: | IC Channel 14-TSSOP |
| Description: | IC HEX INVERTER 14TSSOP |
| Email: | [email protected] |
Related parts for 74LVCU04APW-Q100J
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
74LVCU04ABQ,115 | Nexperia USA Inc. | IC HEX INVERTER 14DHVQFN | Inquiry |
 |
74LVCU04APW,118 | Nexperia USA Inc. | IC HEX INVERTER 14TSSOP | Inquiry |
 |
74LVCU04AD,112 | Nexperia USA Inc. | IC HEX INVERTER 14SOIC | Inquiry |
 |
74LVCU04ADB,112 | Nexperia USA Inc. | IC HEX INVERTER 14SSOP | Inquiry |
|
74LVCU04AD,118 | Nexperia USA Inc. | IC HEX INVERTER 14-SOIC | Inquiry |
|
74LVCU04AD-Q100J | Nexperia USA Inc. | IC HEX INVERTER 14SO | Inquiry |
|
74LVCU04APW,112 | Nexperia USA Inc. | IC HEX INVERTER 14TSSOP | Inquiry |
|
74LVCU04ADB,118 | Nexperia USA Inc. | IC HEX INVERTER 14SSOP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers