BYCHIPS is the stocking distributor for 74LVC1G384GS,132, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74LVC1G384GS,132 by email, we will give you a best price according your plan.
Buy 74LVC1G384GS,132 with BYCHPS
Buy with guarantee
74LVC1G384GS,132
- Part Number:
- 74LVC1G384GS,132
- Manufacturer:
- Nexperia
- Description:
- IC BILATERAL SWITCH 6XSON
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15969 Pieces
- Data sheet:
- 74LVC1G384GS,132.pdf
Introduction
Specifications
| Voltage - Supply, Single (V+): | 1.65 V ~ 5.5 V |
|---|---|
| Voltage - Supply, Dual (V±): | - |
| Switch Time (Ton, Toff) (Max): | 4.2ns, 5ns |
| Switch Circuit: | SPST - NC |
| Supplier Device Package: | 6-XSON, SOT1202 (1x1) |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 6-XFDFN |
| Other Names: | 935292913132 |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| On-State Resistance (Max): | 10 Ohm |
| Number of Circuits: | 1 |
| Multiplexer/Demultiplexer Circuit: | 1:1 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | 74LVC1G384GS,132 |
| Expanded Description: | 1 Circuit IC Switch 1:1 10 Ohm 6-XSON, SOT1202 (1x1) |
| Description: | IC BILATERAL SWITCH 6XSON |
| Current - Leakage (IS(off)) (Max): | 5µA |
| Crosstalk: | - |
| Charge Injection: | 7.5pC |
| Channel-to-Channel Matching (ΔRon): | - |
| Channel Capacitance (CS(off), CD(off)): | 5pF |
| -3db Bandwidth: | 500MHz |
| Email: | [email protected] |
Related parts for 74LVC1G384GS,132
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers