BYCHIPS is the stocking distributor for 74LVC07ABQ-Q100X, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74LVC07ABQ-Q100X by email, we will give you a best price according your plan.
Buy 74LVC07ABQ-Q100X with BYCHPS
Buy with guarantee
74LVC07ABQ-Q100X
- Part Number:
- 74LVC07ABQ-Q100X
- Manufacturer:
- Nexperia
- Description:
- IC HEX BUFFER OPEN-DRN 14DHVQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15628 Pieces
- Data sheet:
- 74LVC07ABQ-Q100X.pdf
Introduction
Specifications
| Voltage - Supply: | 1.2 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 14-DQFN (3x2.5) |
| Series: | Automotive, AEC-Q100, 74LVC |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 14-VFQFN Exposed Pad |
| Output Type: | Open Drain |
| Other Names: | 935299495115 |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Number of Elements: | 6 |
| Number of Bits per Element: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | 74LVC07ABQ-Q100X |
| Logic Type: | Buffer, Non-Inverting |
| Input Type: | - |
| Expanded Description: | Buffer, Non-Inverting Element 1 Bit per Element Open Drain Output 14-DQFN (3x2.5) |
| Description: | IC HEX BUFFER OPEN-DRN 14DHVQFN |
| Current - Output High, Low: | -, 32mA |
| Email: | [email protected] |
Related parts for 74LVC07ABQ-Q100X
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers