BYCHIPS is the stocking distributor for 74CB3T16211DGGRE4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74CB3T16211DGGRE4 by email, we will give you a best price according your plan.
Buy 74CB3T16211DGGRE4 with BYCHPS
Buy with guarantee
74CB3T16211DGGRE4
- Part Number:
- 74CB3T16211DGGRE4
- Manufacturer:
- Description:
- IC 24BIT FET BUS SWITCH 56-TSSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14851 Pieces
- Data sheet:
- 74CB3T16211DGGRE4.pdf
Introduction
Specifications
| Voltage Supply Source: | Single Supply |
|---|---|
| Voltage - Supply: | 2.3 V ~ 3.6 V |
| Type: | Bus Switch |
| Supplier Device Package: | 56-TSSOP |
| Series: | 74CB |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 56-TFSOP (0.240", 6.10mm Width) |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | 74CB3T16211DGGRE4 |
| Independent Circuits: | 2 |
| Expanded Description: | Bus Switch 12 x 1:1 56-TSSOP |
| Description: | IC 24BIT FET BUS SWITCH 56-TSSOP |
| Current - Output High, Low: | - |
| Circuit: | 12 x 1:1 |
| Email: | [email protected] |
Related parts for 74CB3T16211DGGRE4
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
74CB3T16211DLRG4 | Texas Instruments | IC 24BIT FET BUS SWITCH 56-SSOP | Inquiry |
|
74CB3T16210DGGRG4 | Texas Instruments | IC FET BUS SWITCH DUAL 48TSSOP | Inquiry |
|
74CB3T16211DGGRG4 | Texas Instruments | IC FET BUS SWITCH DUAL 56TSSOP | Inquiry |
|
74CB3T16212DGGRG4 | Texas Instruments | IC BUS FET EXCH SWIT SGL 56TSSOP | Inquiry |
|
74CB3T1G125DBVRG4 | Texas Instruments | IC FET BUS SWITCH SGL SOT23-5 | Inquiry |
|
74CB3T1G125DBVRE4 | Texas Instruments | IC SWITCH BUS SINGLE FET SOT23-5 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers