BYCHIPS is the stocking distributor for 74277233, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 74277233 by email, we will give you a best price according your plan.
Buy 74277233 with BYCHPS
Buy with guarantee
74277233
- Part Number:
- 74277233
- Manufacturer:
- Wurth Electronics
- Description:
- FERRITE CORE 40 OHM SOLID 4.8MM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16966 Pieces
- Data sheet:
- 1.74277233.pdf2.74277233.pdf
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | WE-AFB LFS |
| Ratings: | - |
| Outer Dimension: | 0.374" Dia (9.50mm) |
| Other Names: | 732-3087 |
| Mounting Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material: | 8W5000 |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | 74277233 |
| Length: | 0.374" (9.50mm) |
| Inner Dimension: | 0.188" Dia (4.80mm) |
| Impedance @ Frequency: | 40 Ohm @ 10MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 40 Ohm @ 10MHz ID 0.188" Dia (4.80mm) OD 0.374" Dia (9.50mm) Length 0.374" (9.50mm) |
| Design: | Solid |
| Description: | FERRITE CORE 40 OHM SOLID 4.8MM |
| Email: | [email protected] |
Related parts for 74277233
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
74277253 | Wurth Electronics Inc. | FERRITE CORE 80 OHM SOLID 8MM | Inquiry |
 |
7427727 | Wurth Electronics Inc. | FERRITE CORE 100 OHM SOLID | Inquiry |
 |
74277255 | Wurth Electronics Inc. | FERRITE CORE 60 OHM SOLID 10.2MM | Inquiry |
 |
782013059285 | Wurth Electronics Inc. | FERRITE CORE 270 OHM SOLID 6.3MM | Inquiry |
 |
74277290 | Wurth Electronics Inc. | FERRITE CORE 50 OHM SOLID 12.8MM | Inquiry |
 |
KR16TT161208 | Panasonic - DTG | FERRITE CORE 45 OHM SOLID 12MM | Inquiry |
 |
7427729 | Wurth Electronics Inc. | FERRITE CORE 60 OHM SOLID 9.5MM | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers