BYCHIPS is the stocking distributor for 73M1R067G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 73M1R067G by email, we will give you a best price according your plan.
Buy 73M1R067G with BYCHPS
Buy with guarantee
73M1R067G
- Part Number:
- 73M1R067G
- Manufacturer:
- CTS Electronic Components
- Description:
- RES SMD 0.067 OHM 2% 1W 2512
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14438 Pieces
- Data sheet:
- 73M1R067G.pdf
Introduction
Specifications
| Tolerance: | ±2% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 2512 |
| Size / Dimension: | 0.244" L x 0.122" W (6.20mm x 3.10mm) |
| Series: | 73M1 |
| Resistance (Ohms): | 0.067 |
| Power (Watts): | 1W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2512 J-Lead |
| Operating Temperature: | -55°C ~ 180°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | 73M1R067G |
| Height - Seated (Max): | 0.047" (1.20mm) |
| Features: | Current Sense |
| Failure Rate: | - |
| Expanded Description: | 0.067 Ohm ±2% 1W Chip Resistor 2512 J-Lead Current Sense Thick Film |
| Description: | RES SMD 0.067 OHM 2% 1W 2512 |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for 73M1R067G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers