BYCHIPS is the stocking distributor for 70F396AI, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 70F396AI by email, we will give you a best price according your plan.
Buy 70F396AI with BYCHPS
Buy with guarantee
70F396AI
- Part Number:
- 70F396AI
- Manufacturer:
- Bourns, Inc.
- Description:
- FIXED IND 3.9UH 870MA 264 MOHM
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 16827 Pieces
- Data sheet:
- 70F396AI.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±10% |
| Supplier Device Package: | Axial |
| Size / Dimension: | 0.150" Dia x 0.250" L (3.81mm x 6.35mm) |
| Shielding: | Unshielded |
| Series: | 70F |
| Ratings: | - |
| Q @ Freq: | 35 @ 7.9MHz |
| Packaging: | Bulk |
| Package / Case: | Axial |
| Operating Temperature: | -55°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Iron |
| Manufacturer Part Number: | 70F396AI |
| Inductance: | 3.9µH |
| Height - Seated (Max): | - |
| Frequency - Test: | 7.9MHz |
| Frequency - Self Resonant: | 61MHz |
| Expanded Description: | 3.9µH Unshielded Wirewound Inductor 870mA 264 mOhm Max Axial |
| Description: | FIXED IND 3.9UH 870MA 264 MOHM |
| DC Resistance (DCR): | 264 mOhm Max |
| Current Rating: | 870mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for 70F396AI
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
LQH32PB101MN0L | Murata Electronics North America | FIXED IND 100UH 250MA 2.7 OHM | Inquiry |
 |
B82464P4472M | EPCOS (TDK) | FIXED IND 4.7UH 4.9A 15 MOHM SMD | Inquiry |
 |
70F391AF | Bourns Inc. | FIXED IND 390MH 33MA 617 OHM TH | Inquiry |
 |
MILS1812R-683K | API Delevan Inc. | FIXED IND 68UH 215MA 4.3 OHM SMD | Inquiry |
 |
L-15W20NJV4E | Johanson Technology Inc. | FIXED IND 20NH 600MA 80 MOHM SMD | Inquiry |
|
70F392AF-RC | Bourns Inc. | FIXED IND 39MH 41MA 147 OHM TH | Inquiry |
|
70F393AI | Bourns Inc. | FIXED IND 3.9MH 51MA 57.6 OHM TH | Inquiry |
|
70F395AI | Bourns Inc. | FIXED IND 39UH 188MA 3.36 OHM TH | Inquiry |
|
70F395AI-RC | Bourns Inc. | FIXED IND 39UH 188MA 3.36 OHM TH | Inquiry |
|
70F393AI-RC | Bourns Inc. | FIXED IND 3.9MH 51MA 57.6 OHM TH | Inquiry |
|
70F396AI-RC | Bourns Inc. | FIXED IND 3.9UH 870MA 264 MOHM | Inquiry |
 |
SL2125-152KR99-PF | TDK Corporation | FIXED IND 1.5MH 990MA 610 MOHM | Inquiry |
|
1008R-680J | API Delevan Inc. | FIXED IND 68NH 823MA 180 MOHM | Inquiry |
 |
70F391AF-RC | Bourns Inc. | FIXED IND 390MH 33MA 617 OHM TH | Inquiry |
|
70F392AF | Bourns Inc. | FIXED IND 39MH 41MA 147 OHM TH | Inquiry |
 |
SRU5028A-150Y | Bourns Inc. | FIXED IND 15UH 1.1A 140 MOHM SMD | Inquiry |
 |
ATCA-07-851M-H | Abracon LLC | FIXED IND 850UH 2A 211 MOHM TH | Inquiry |
|
70F394AI-RC | Bourns Inc. | FIXED IND 390UH 97MA 15.8 OHM TH | Inquiry |
|
70F394AI | Bourns Inc. | FIXED IND 390UH 97MA 15.8 OHM TH | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers