BYCHIPS is the stocking distributor for 670-0014, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 670-0014 by email, we will give you a best price according your plan.
Buy 670-0014 with BYCHPS
Buy with guarantee
670-0014
- Part Number:
- 670-0014
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY SOCKET
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16007 Pieces
- Data sheet:
- 670-0014.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Other Names: | 2-1608090-0 6700014 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 670-0014 |
| Expanded Description: | |
| Description: | RELAY SOCKET |
| Email: | [email protected] |
Related parts for 670-0014
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
670-0016 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET | Inquiry |
|
670-0013 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET | Inquiry |
|
670-0154 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET | Inquiry |
 |
2833644 | Phoenix Contact | EQUIPMENT MARKER LABELING 9X25MM | Inquiry |
|
670-0120 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET | Inquiry |
 |
2900940 | Phoenix Contact | RIF-LDP-48-60 DC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers