BYCHIPS is the stocking distributor for 600S3R3BW250XT, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 600S3R3BW250XT by email, we will give you a best price according your plan.
Buy 600S3R3BW250XT with BYCHPS
Buy with guarantee
600S3R3BW250XT
- Part Number:
- 600S3R3BW250XT
- Manufacturer:
- American Technical Ceramics
- Description:
- CAP CER 3.3PF 250V NP0 0603
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12797 Pieces
- Data sheet:
- 600S3R3BW250XT.pdf
Introduction
Specifications
| Voltage - Rated: | 250V |
|---|---|
| Tolerance: | ±0.1pF |
| Thickness (Max): | 0.035" (0.89mm) |
| Temperature Coefficient: | C0G, NP0 |
| Size / Dimension: | 0.063" L x 0.032" W (1.60mm x 0.81mm) |
| Series: | ATC 600S |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0603 (1608 Metric) |
| Other Names: | 600S3R3BW 600S3R3BWDRB 600S3R3BWDRN ATC600S3R3BW250XT |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 600S3R3BW250XT |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | High Q, Low Loss, Ultra Low ESR |
| Expanded Description: | 3.3pF ±0.1pF 250V Ceramic Capacitor C0G, NP0 0603 (1608 Metric) |
| Description: | CAP CER 3.3PF 250V NP0 0603 |
| Capacitance: | 3.3pF |
| Applications: | RF, Microwave, High Frequency |
| Email: | [email protected] |
Related parts for 600S3R3BW250XT
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers