BYCHIPS is the stocking distributor for 506DCR2R3SKV, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 506DCR2R3SKV by email, we will give you a best price according your plan.
Buy 506DCR2R3SKV with BYCHPS
Buy with guarantee
506DCR2R3SKV
- Part Number:
- 506DCR2R3SKV
- Manufacturer:
- Illinois Capacitor
- Description:
- CAP 50F -20%, +50% 2.3V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13440 Pieces
- Data sheet:
- 506DCR2R3SKV.pdf
Introduction
Specifications
| Voltage - Rated: | 2.3V |
|---|---|
| Tolerance: | -20%, +50% |
| Termination: | PC Pins |
| Size / Dimension: | 0.630" Dia (16.00mm) |
| Series: | DCR |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Operating Temperature: | -25°C ~ 70°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | 506DCR2R3SKV |
| Lifetime @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.295" (7.50mm) |
| Height - Seated (Max): | 1.040" (26.50mm) |
| Expanded Description: | 50F -20%, +50%(EDLC) Supercapacitor 2.3V Radial, Can - Snap-In 60 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Series Resistance): | 60 mOhm @ 1kHz |
| Description: | CAP 50F -20%, +50% 2.3V T/H |
| Capacitance: | 50F |
| Email: | [email protected] |
Related parts for 506DCR2R3SKV
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EDLF105B5R5C | Cornell Dubilier Electronics (CDE) | CAP 1F 5.5V THROUGH HOLE | Inquiry |
 |
BZ013B503ZSB | AVX Corporation | CAP 50MF -20% +80% 3.6V SMD | Inquiry |
 |
MAL219690113E3 | Vishay BC Components | CAP 90F -20%, +80% 2.8V T/H | Inquiry |
 |
EEC-HW0D506 | Panasonic Electronic Components | CAP 50F -20% +40% 2.3V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers