BYCHIPS is the stocking distributor for 4306R-101-820, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 4306R-101-820 by email, we will give you a best price according your plan.
Buy 4306R-101-820 with BYCHPS
Buy with guarantee
4306R-101-820
- Part Number:
- 4306R-101-820
- Manufacturer:
- Bourns, Inc.
- Description:
- RES ARRAY 5 RES 82 OHM 6SIP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 13841 Pieces
- Data sheet:
- 4306R-101-820.pdf
Introduction
Specifications
| Tolerance: | ±2% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 6-SIP |
| Size / Dimension: | 0.584" L x 0.085" W (14.83mm x 2.16mm) |
| Series: | 4300R |
| Resistance (Ohms): | 82 |
| Power Per Element: | 200mW |
| Packaging: | Bulk |
| Package / Case: | 6-SIP |
| Other Names: | 4306R-1-820 |
| Operating Temperature: | -55°C ~ 125°C |
| Number of Resistors: | 5 |
| Number of Pins: | 6 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | 4306R-101-820 |
| Height - Seated (Max): | 0.195" (4.95mm) |
| Expanded Description: | 82 Ohm ±2% 200mW Power Per Element Bussed Resistor Network/Array ±100ppm/°C 6-SIP |
| Description: | RES ARRAY 5 RES 82 OHM 6SIP |
| Circuit Type: | Bussed |
| Applications: | - |
| Email: | [email protected] |
Related parts for 4306R-101-820
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
4306R-102-820 | Bourns Inc. | RES ARRAY 3 RES 82 OHM 6SIP | Inquiry |
|
4306R-101-510LF | Bourns Inc. | RES ARRAY 5 RES 51 OHM 6SIP | Inquiry |
|
4306R-102-562LF | Bourns Inc. | RES ARRAY 3 RES 5.6K OHM 6SIP | Inquiry |
|
4306R-102-390LF | Bourns Inc. | RES ARRAY 3 RES 39 OHM 6SIP | Inquiry |
|
4306R-101-154LF | Bourns Inc. | RES ARRAY 5 RES 150K OHM 6SIP | Inquiry |
|
4306R-101-182 | Bourns Inc. | RES ARRAY 5 RES 1.8K OHM 6SIP | Inquiry |
|
4306R-101-224 | Bourns Inc. | RES ARRAY 5 RES 220K OHM 6SIP | Inquiry |
|
4306R-104-331/471L | Bourns Inc. | RES NETWORK 8 RES MULT OHM 6SIP | Inquiry |
|
4306R-102-330 | Bourns Inc. | RES ARRAY 3 RES 33 OHM 6SIP | Inquiry |
|
4306R-101-500 | Bourns Inc. | RES ARRAY 5 RES 50 OHM 6SIP | Inquiry |
|
4306R-102-203 | Bourns Inc. | RES ARRAY 3 RES 20K OHM 6SIP | Inquiry |
|
4306R-101-104LF | Bourns Inc. | RES ARRAY 5 RES 100K OHM 6SIP | Inquiry |
|
4306R-101-333 | Bourns Inc. | RES ARRAY 5 RES 33K OHM 6SIP | Inquiry |
|
4306R-104-302/622 | Bourns Inc. | RES NETWORK 8 RES MULT OHM 6SIP | Inquiry |
|
4306R-101-564LF | Bourns Inc. | RES ARRAY 5 RES 560K OHM 6SIP | Inquiry |
|
4306R-102-472 | Bourns Inc. | RES ARRAY 3 RES 4.7K OHM 6SIP | Inquiry |
|
4306R-101-121LF | Bourns Inc. | RES ARRAY 5 RES 120 OHM 6SIP | Inquiry |
|
4306R-101-101LF | Bourns Inc. | RES ARRAY 5 RES 100 OHM 6SIP | Inquiry |
 |
4306R-102-120LF | Bourns Inc. | RES ARRAY 3 RES 12 OHM 6SIP | Inquiry |
|
4306R-101-394 | Bourns Inc. | RES ARRAY 5 RES 390K OHM 6SIP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers