BYCHIPS is the stocking distributor for 4306M-102-222, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 4306M-102-222 by email, we will give you a best price according your plan.
Buy 4306M-102-222 with BYCHPS
Buy with guarantee
4306M-102-222
- Part Number:
- 4306M-102-222
- Manufacturer:
- Bourns, Inc.
- Description:
- RES ARRAY 3 RES 2.2K OHM 6SIP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 17934 Pieces
- Data sheet:
- 4306M-102-222.pdf
Introduction
Specifications
| Tolerance: | ±2% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 6-SIP |
| Size / Dimension: | 0.584" L x 0.085" W (14.83mm x 2.16mm) |
| Series: | 4300M |
| Resistance (Ohms): | 2.2k |
| Power Per Element: | 400mW |
| Packaging: | Tube |
| Package / Case: | 6-SIP |
| Operating Temperature: | -55°C ~ 125°C |
| Number of Resistors: | 3 |
| Number of Pins: | 6 |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 4306M-102-222 |
| Height - Seated (Max): | 0.250" (6.35mm) |
| Expanded Description: | 2.2k Ohm ±2% 400mW Power Per Element Isolated Resistor Network/Array ±100ppm/°C 6-SIP |
| Description: | RES ARRAY 3 RES 2.2K OHM 6SIP |
| Circuit Type: | Isolated |
| Applications: | - |
| Email: | [email protected] |
Related parts for 4306M-102-222
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
4306M-102-330LF | Bourns Inc. | RES ARRAY 3 RES 33 OHM 6SIP | Inquiry |
 |
4306M-101-202 | Bourns Inc. | RES ARRAY 5 RES 2K OHM 6SIP | Inquiry |
|
4306M-101-103LF | Bourns Inc. | RES ARRAY 5 RES 10K OHM 6SIP | Inquiry |
|
4306M-102-332LF | Bourns Inc. | RES ARRAY 3 RES 3.3K OHM 6SIP | Inquiry |
|
4306M-101-102LF | Bourns Inc. | RES ARRAY 5 RES 1K OHM 6SIP | Inquiry |
|
4306M-101-562LF | Bourns Inc. | RES ARRAY 5 RES 5.6K OHM 6SIP | Inquiry |
|
4306M-101-203 | Bourns Inc. | RES ARRAY 5 RES 20K OHM 6SIP | Inquiry |
|
4306M-102-473LF | Bourns Inc. | RES ARRAY 3 RES 47K OHM 6SIP | Inquiry |
|
4306M-102-202LF | Bourns Inc. | RES ARRAY 3 RES 2K OHM 6SIP | Inquiry |
|
4306M-102-220 | Bourns Inc. | RES ARRAY 3 RES 22 OHM 6SIP | Inquiry |
|
4306M-101-273 | Bourns Inc. | RES ARRAY 5 RES 27K OHM 6SIP | Inquiry |
|
4306M-102-301LF | Bourns Inc. | RES ARRAY 3 RES 300 OHM 6SIP | Inquiry |
|
4306M-102-153LF | Bourns Inc. | RES ARRAY 3 RES 15K OHM 6SIP | Inquiry |
|
4306M-101-153LF | Bourns Inc. | RES ARRAY 5 RES 15K OHM 6SIP | Inquiry |
|
4306M-101-223LF | Bourns Inc. | RES ARRAY 5 RES 22K OHM 6SIP | Inquiry |
|
4306M-101-122LF | Bourns Inc. | RES ARRAY 5 RES 1.2K OHM 6SIP | Inquiry |
|
4306M-102-102LF | Bourns Inc. | RES ARRAY 3 RES 1K OHM 6SIP | Inquiry |
|
4306M-101-392LF | Bourns Inc. | RES ARRAY 5 RES 3.9K OHM 6SIP | Inquiry |
|
4306M-101-203LF | Bourns Inc. | RES ARRAY 5 RES 20K OHM 6SIP | Inquiry |
|
4306M-101-152LF | Bourns Inc. | RES ARRAY 5 RES 1.5K OHM 6SIP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers