BYCHIPS is the stocking distributor for 38YD152D3777, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 38YD152D3777 by email, we will give you a best price according your plan.
Buy 38YD152D3777 with BYCHPS
Buy with guarantee
38YD152D3777
- Part Number:
- 38YD152D3777
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE SPST 35A 395V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15274 Pieces
- Data sheet:
- 38YD152D3777.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 275 VAC |
|---|---|
| Turn Off Voltage (Min): | 120 VAC |
| Termination Style: | Quick Connect - 0.250" (6.3mm) |
| Switching Voltage: | 277VAC - Max |
| Series: | 38, Products Unlimited |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 5-1611759-5 |
| Operating Temperature: | - |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Part Number: | 38YD152D3777 |
| Features: | Insulation - Class B |
| Expanded Description: | General Purpose Relay SPST-NC (1 Form B) 395VAC Coil Chassis Mount |
| Description: | RELAY GEN PURPOSE SPST 35A 395V |
| Contact Rating (Current): | 35A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | SPST-NC (1 Form B) |
| Coil Voltage: | 395VAC |
| Coil Type: | Non Latching |
| Coil Resistance: | - |
| Coil Power: | 5 VA |
| Coil Current: | 12.7mA |
| Email: | [email protected] |
Related parts for 38YD152D3777
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers