BYCHIPS is the stocking distributor for 381LQ222M080H042, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 381LQ222M080H042 by email, we will give you a best price according your plan.
Buy 381LQ222M080H042 with BYCHPS
Buy with guarantee
381LQ222M080H042
- Part Number:
- 381LQ222M080H042
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP ALUM 2200UF 20% 80V SNAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14940 Pieces
- Data sheet:
- 381LQ222M080H042.pdf
Introduction
Specifications
| Voltage Rating: | 80V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.866" Dia (22.00mm) |
| Series: | 381LQ |
| Ripple Current: | 2.1A @ 120Hz |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Operating Temperature: | -40°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 21 Weeks |
| Manufacturer Part Number: | 381LQ222M080H042 |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 1.654" (42.00mm) |
| Expanded Description: | 2200µF 80V Aluminum Capacitors Radial, Can - Snap-In 128 mOhm @ 120Hz 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 128 mOhm @ 120Hz |
| Description: | CAP ALUM 2200UF 20% 80V SNAP |
| Capacitance: | 2200µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 381LQ222M080H042
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers