BYCHIPS is the stocking distributor for 36502A3N3JTDG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 36502A3N3JTDG by email, we will give you a best price according your plan.
Buy 36502A3N3JTDG with BYCHPS
Buy with guarantee
36502A3N3JTDG
- Part Number:
- 36502A3N3JTDG
- Manufacturer:
- AMP Connectors / TE Connectivity
- Description:
- FIXED IND 3.3NH 600MA 80 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12242 Pieces
- Data sheet:
- 1.36502A3N3JTDG.pdf2.36502A3N3JTDG.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±5% |
| Supplier Device Package: | 0907 (2317 Metric) |
| Size / Dimension: | 0.090" L x 0.068" W (2.29mm x 1.73mm) |
| Shielding: | Unshielded |
| Series: | 3650, Sigma Inductors |
| Ratings: | - |
| Q @ Freq: | 50 @ 1.5GHz |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Nonstandard |
| Other Names: | 2-1624113-3 216241133 A103781TR |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | - |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | 36502A3N3JTDG |
| Inductance: | 3.3nH |
| Height - Seated (Max): | 0.060" (1.52mm) |
| Frequency - Test: | 250MHz |
| Frequency - Self Resonant: | 6GHz |
| Expanded Description: | 3.3nH Unshielded Wirewound Inductor 600mA 80 mOhm Max Nonstandard |
| Description: | FIXED IND 3.3NH 600MA 80 MOHM |
| DC Resistance (DCR): | 80 mOhm Max |
| Current Rating: | 600mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for 36502A3N3JTDG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers