BYCHIPS is the stocking distributor for 337HSM050M, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 337HSM050M by email, we will give you a best price according your plan.
Buy 337HSM050M with BYCHPS
Buy with guarantee
337HSM050M
- Part Number:
- 337HSM050M
- Manufacturer:
- Illinois Capacitor
- Description:
- CAP ALUM 330UF 20% 50V THRU HOLE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19811 Pieces
- Data sheet:
- 337HSM050M.pdf
Introduction
Specifications
| Voltage Rating: | 50V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.492" Dia (12.50mm) |
| Series: | HSM |
| Ripple Current: | 430mA |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | 337HSM050M |
| Lifetime @ Temp.: | 2000 Hrs @ 125°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 0.846" (21.50mm) |
| Expanded Description: | 330µF 50V Aluminum Capacitors Radial, Can 502 mOhm @ 120Hz 2000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 502 mOhm @ 120Hz |
| Description: | CAP ALUM 330UF 20% 50V THRU HOLE |
| Capacitance: | 330µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 337HSM050M
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
515D108M010CD8PE3 | Vishay Sprague | CAP ALUM 1000UF 20% 10V RADIAL | Inquiry |
 |
ALS80P392NF500 | KEMET | ALU SCREW TERMINAL 3900UF 500V | Inquiry |
 |
LKX2W271MESC30 | Nichicon | CAP ALUM 270UF 20% 450V SNAP | Inquiry |
 |
MAL214258222E3 | Vishay BC Components | CAP ALUM 2200UF 20% 63V RADIAL | Inquiry |
 |
337HSM063M | Illinois Capacitor | CAP ALUM 330UF 20% 63V THRU HOLE | Inquiry |
 |
MAL214099812E3 | Vishay BC Components | CAP ALUM 220UF 20% 63V SMD | Inquiry |
|
MALIEYH07CV512F02K | Vishay BC Components | CAP ALUM 12000UF 20% 35V SNAP | Inquiry |
 |
URZ0J472MHD | Nichicon | CAP ALUM 4700UF 20% 6.3V RADIAL | Inquiry |
 |
ULT2D180MNL1GS | Nichicon | CAP ALUM 18UF 20% 200V SMD | Inquiry |
|
ALS80H184KF025 | KEMET | ALU SCREW TERMINAL 180000UF 25V | Inquiry |
 |
381LQ681M250J042 | Cornell Dubilier Electronics (CDE) | CAP ALUM 680UF 20% 250V SNAP | Inquiry |
 |
EEV-HA1V220P | Panasonic Electronic Components | CAP ALUM 22UF 20% 35V SMD | Inquiry |
 |
B41044A2476M | EPCOS (TDK) | CAP ALUM 47UF 20% 6.3V RADIAL | Inquiry |
 |
ERLA201LIN162KA45M | United Chemi-Con | CAP ALUM 1600UF 10% 200V SNAP | Inquiry |
 |
UWT0J681MNR1GS | Nichicon | CAP ALUM 680UF 20% 6.3V SMD | Inquiry |
 |
UVR2V101MHA | Nichicon | CAP ALUM 100UF 20% 350V RADIAL | Inquiry |
|
B43630A5107M000 | EPCOS (TDK) | CAP ALUM 100UF 20% 450V SNAP | Inquiry |
|
B43086A9336M | EPCOS (TDK) | CAP ALUM 33UF 20% 400V RADIAL | Inquiry |
 |
25ML220MEFC8X9 | Rubycon | CAP ALUM 220UF 20% 25V RADIAL | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers