BYCHIPS is the stocking distributor for 335PHB600K2H, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 335PHB600K2H by email, we will give you a best price according your plan.
Buy 335PHB600K2H with BYCHPS
Buy with guarantee
335PHB600K2H
- Part Number:
- 335PHB600K2H
- Manufacturer:
- Illinois Capacitor
- Description:
- CAP FILM 3.3UF 10% 600VDC RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15229 Pieces
- Data sheet:
- 335PHB600K2H.pdf
Introduction
Specifications
| Voltage Rating - DC: | 600V |
|---|---|
| Voltage Rating - AC: | 350V |
| Tolerance: | ±10% |
| Termination: | PC Pins |
| Size / Dimension: | 1.260" L x 0.866" W (32.00mm x 22.00mm) |
| Series: | PHB |
| Packaging: | Bulk |
| Package / Case: | Radial |
| Operating Temperature: | -40°C ~ 100°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | 335PHB600K2H |
| Lead Spacing: | 1.083" (27.50mm) |
| Height - Seated (Max): | 1.457" (37.00mm) |
| Features: | - |
| Expanded Description: | 3.3µF ±10% Film Capacitor 350V 600V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | 3.2 mOhm |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 3.3UF 10% 600VDC RADIAL |
| Capacitance: | 3.3µF |
| Applications: | High Frequency, Switching |
| Email: | [email protected] |
Related parts for 335PHB600K2H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers