BYCHIPS is the stocking distributor for 3352-GX-X27-RC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 3352-GX-X27-RC by email, we will give you a best price according your plan.
Buy 3352-GX-X27-RC with BYCHPS
Buy with guarantee
3352-GX-X27-RC
- Part Number:
- 3352-GX-X27-RC
- Manufacturer:
- Critical Link
- Description:
- MITYSOM-335X SOM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12238 Pieces
- Data sheet:
- 1.3352-GX-X27-RC.pdf2.3352-GX-X27-RC.pdf
Introduction
Specifications
| Speed: | 720MHz |
|---|---|
| Size / Dimension: | 2.66" x 1.5" (67.6mm x 38.1mm) |
| Series: | MitySOM |
| RAM Size: | 256MB |
| Other Names: | 80-000583RC-1 |
| Operating Temperature: | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Module/Board Type: | MPU Core |
| Manufacturer Part Number: | 3352-GX-X27-RC |
| Flash Size: | 256MB |
| Expanded Description: | MitySOM Embedded Module ARM® Cortex®-A8, AM3352 NEON SIMD 720MHz 256MB 256MB |
| Description: | MITYSOM-335X SOM |
| Core Processor: | ARM® Cortex®-A8, AM3352 |
| Connector Type: | SO-DIMM-204 |
| Co-Processor: | NEON SIMD |
| Email: | [email protected] |
Related parts for 3352-GX-X27-RC
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
3352-HX-X27-RC | Critical Link LLC | MITYSOM-3352 W/ AM3352 | Inquiry |
 |
CENGLH7A404-11-403EI | Logic | CARD ENGINE 32MB SDRAM | Inquiry |
 |
20-101-0080 | Digi International | CORE MODULE CM7110 | Inquiry |
|
FS-385 | Digi International | MODULE 128MB SDRAM 128MB FLASH | Inquiry |
|
3352-HX-X47-RI | Critical Link LLC | MITYSOM-3352 W/ AM3352 | Inquiry |
|
20-101-1184 | Digi International | MPU MODULE RABBIT 2000 TWO PACK | Inquiry |
|
3352-HX-X27-RI | Critical Link LLC | MITYSOM-3352 W/ AM3352 | Inquiry |
|
3352-HX-XX7-RI | Critical Link LLC | MITYSOM-3352 W/ AM3352 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers