BYCHIPS is the stocking distributor for 2A1/J, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 2A1/J by email, we will give you a best price according your plan.
Buy 2A1/J with BYCHPS
Buy with guarantee
2A1/J
- Part Number:
- 2A1/J
- Manufacturer:
- Bussmann (Eaton)
- Description:
- QUICK CONNECT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19281 Pieces
- Data sheet:
- 2A1/J.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Other Names: | 2A1-J |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 2A1/J |
| Description: | QUICK CONNECT |
| Email: | [email protected] |
Related parts for 2A1/J
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
2A1986-1 | Eaton | PANEL LOCK 18 POSITION QSCP | Inquiry |
|
2A1960-3 | Eaton | KIT BRANCH ENCLOSURE 42 | Inquiry |
|
2A1961-1 | Eaton | KIT SPARE FUSE COMPARTMENT TCF 1 | Inquiry |
|
2A1909-12 | Eaton | KIT MAIN CP LUG 1P3W 30-60A | Inquiry |
|
2A1909-20 | Eaton | KIT MAIN CP LUG 3 PHASE 225-400A | Inquiry |
|
2A1959-2 | Eaton | SKIRT FOR QSCP 28" | Inquiry |
|
2A1667-6 | Eaton | DOOR IN DOOR 59 | Inquiry |
|
2A1702-19 | Eaton | LINE SIDE DEAD FRONT ASSEMBLY | Inquiry |
|
2A1630-6 | Eaton | MAIN DEVICE SUB ASSY 200A | Inquiry |
|
2A1690-4BK | Eaton | CAN 33 BLANK KNOCKOUT | Inquiry |
|
2A1630-1 | Eaton | MAIN DEVICE SUB ASSY 200A | Inquiry |
|
2A1690-1BB | Eaton | CAN 50 BLANK BLANK | Inquiry |
|
2A1649-1 | Eaton | ENCLOSURE 50 | Inquiry |
|
2A1702-14 | Eaton | LINE SIDE DEAD FRONT ASSEMBLY | Inquiry |
|
2A1667-11 | Eaton | DOOR IN DOOR 69 | Inquiry |
|
2A1690-1KK | Eaton | CAN 50 KNOCKOUT KNOCKOUT | Inquiry |
|
2A1909-15 | Eaton | KIT MAIN MECHANICAL LUG 1P2W 70- | Inquiry |
|
2A1909-28 | Eaton | KIT MAIN SUB-FEED LUG 1P2W 225-4 | Inquiry |
|
2A1649-2 | Eaton | ENCLOSURE 59 | Inquiry |
|
2A1912-5 | Eaton | KIT BRANCH LOCKOUT (3M PANELSAFE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers