BYCHIPS is the stocking distributor for 28R1025-000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 28R1025-000 by email, we will give you a best price according your plan.
Buy 28R1025-000 with BYCHPS
Buy with guarantee
28R1025-000
- Part Number:
- 28R1025-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 97 OHM SOLID
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16303 Pieces
Introduction
Specifications
| Type: | Flat |
|---|---|
| Series: | 28 |
| Ratings: | - |
| Outer Dimension: | 1.024" W x 0.197" H (26.00mm x 5.00mm) |
| Mounting Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material: | 28 |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | 28R1025-000 |
| Length: | 0.394" (10.00mm) |
| Inner Dimension: | 0.843" W x 0.030" H (21.40mm x 0.75mm) |
| Impedance @ Frequency: | 97 Ohm @ 100MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 97 Ohm @ 100MHz ID 0.843" W x 0.030" H (21.40mm x 0.75mm) OD 1.024" W x 0.197" H (26.00mm x 5.00mm) Length 0.394" (10.00mm) |
| Design: | Solid |
| Description: | FERRITE CORE 97 OHM SOLID |
| Email: | [email protected] |
Related parts for 28R1025-000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
28B0563-000 | Laird-Signal Integrity Products | FERRITE CORE 173 OHM SOLID | Inquiry |
 |
28R1022-000 | Laird-Signal Integrity Products | FERRITE CORE 91 OHM SOLID | Inquiry |
|
28B0395-000 | Laird-Signal Integrity Products | FERRITE CORE 83 OHM SOLID 5.97MM | Inquiry |
|
28R1024-000 | Laird-Signal Integrity Products | FERRITE CORE 128 OHM SOLID | Inquiry |
 |
B-20L-48B | KEMET | FERRITE CORE SOLID 2.4MM | Inquiry |
|
28R1128-200 | Laird-Signal Integrity Products | FERRITE CORE 145 OHM SOLID | Inquiry |
 |
28R1775-000 | Laird-Signal Integrity Products | FERRITE CORE 260 OHM SOLID | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers