BYCHIPS is the stocking distributor for 28B2400-000, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 28B2400-000 by email, we will give you a best price according your plan.
Buy 28B2400-000 with BYCHPS
Buy with guarantee
28B2400-000
- Part Number:
- 28B2400-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 135 OHM SOLID
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12282 Pieces
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | 28 |
| Ratings: | - |
| Outer Dimension: | 2.400" Dia (60.96mm) |
| Other Names: | 240-2120 28B2400000 |
| Mounting Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material: | 28 |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | 28B2400-000 |
| Length: | 0.500" (12.70mm) |
| Inner Dimension: | 1.400" Dia (35.56mm) |
| Impedance @ Frequency: | 135 Ohm @ 100MHz |
| Expanded Description: | Solid Free Hanging Ferrite Core 135 Ohm @ 100MHz ID 1.400" Dia (35.56mm) OD 2.400" Dia (60.96mm) Length 0.500" (12.70mm) |
| Design: | Solid |
| Description: | FERRITE CORE 135 OHM SOLID |
| Email: | [email protected] |
Related parts for 28B2400-000
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
HFB259128-100 | Laird-Signal Integrity Products | FERRITE CORE 175 OHM SOLID | Inquiry |
 |
FB43-226-RC | Bourns Inc. | FERRITE CORE SOLID 1.52MM | Inquiry |
 |
CF2-36*23*15 | API Delevan Inc. | FERRITE CORE 101 OHM SOLID 23MM | Inquiry |
 |
7427006 | Wurth Electronics Inc. | FERRITE CORE 70 OHM SOLID 8.5MM | Inquiry |
 |
7427802 | Wurth Electronics Inc. | FERRITE CORE 65 OHM SOLID | Inquiry |
 |
28S2001-2A2 | Laird-Signal Integrity Products | FERRITE CORE 230 OHM HINGED | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers