BYCHIPS is the stocking distributor for 28A2738-0A0, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 28A2738-0A0 by email, we will give you a best price according your plan.
Buy 28A2738-0A0 with BYCHPS
Buy with guarantee
28A2738-0A0
- Part Number:
- 28A2738-0A0
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FERRITE CORE 233 OHM HINGED 8MM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13448 Pieces
- Data sheet:
- 1.28A2738-0A0.pdf2.28A2738-0A0.pdf
Introduction
Specifications
| Type: | Round |
|---|---|
| Series: | 28 |
| Ratings: | - |
| Outer Dimension: | 0.709" W x 0.776" H (18.00mm x 19.70mm) |
| Other Names: | 240-2602 |
| Mounting Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material: | 28 |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | 28A2738-0A0 |
| Length: | 1.382" (35.10mm) |
| Inner Dimension: | 0.315" Dia (8.00mm) |
| Impedance @ Frequency: | 233 Ohm @ 100MHz |
| Expanded Description: | Hinged (Snap On) Free Hanging Ferrite Core 233 Ohm @ 100MHz ID 0.315" Dia (8.00mm) OD 0.709" W x 0.776" H (18.00mm x 19.70mm) Length 1.382" (35.10mm) |
| Design: | Hinged (Snap On) |
| Description: | FERRITE CORE 233 OHM HINGED 8MM |
| Email: | [email protected] |
Related parts for 28A2738-0A0
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
7427226 | Wurth Electronics Inc. | FERRITE CORE 75 OHM SOLID | Inquiry |
 |
28A2736-0A2 | Laird-Signal Integrity Products | FERRITE CORE 220 OHM HINGED 9MM | Inquiry |
 |
28A2738-0A2 | Laird-Signal Integrity Products | FERRITE CORE 233 OHM HINGED 9MM | Inquiry |
 |
28A2736-000 | Laird-Signal Integrity Products | FERRITE CORE HINGED | Inquiry |
|
28S2012-000 | Laird-Signal Integrity Products | FERRITE CORE CLIP 2PCS=1 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers