BYCHIPS is the stocking distributor for 27E164, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 27E164 by email, we will give you a best price according your plan.
Buy 27E164 with BYCHPS
Buy with guarantee
27E164
- Part Number:
- 27E164
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- SOCKET PHEN 6POLE FOR R10 SER
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13023 Pieces
- Data sheet:
- 27E164.pdf
Introduction
Specifications
| Type: | Socket |
|---|---|
| Termination Style: | Solder Lug |
| Series: | R10 |
| Other Names: | 1-1393143-8 |
| Number of Positions: | 22 |
| Mounting Type: | Panel Mount |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 27E164 |
| For Use With/Related Products: | R10 Series |
| Features: | Without Grounding |
| Expanded Description: | Relay Socket Panel Mount |
| Description: | SOCKET PHEN 6POLE FOR R10 SER |
| Email: | [email protected] |
Related parts for 27E164
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
P2RF-08-S | Omron Automation and Safety | SOCKET RELAY SCREWLESS G2R-2-S | Inquiry |
 |
RSE120158-S | Amphenol PCD | STAINLESS STEEL ALTERNATIVE | Inquiry |
 |
27E162 | TE Connectivity Potter & Brumfield Relays | SOCKET DP-2P R10 SERIES | Inquiry |
 |
27E163 | TE Connectivity Potter & Brumfield Relays | SOCKET 4POLE R10 SERIES | Inquiry |
 |
27E166 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET CHASSIS MOUNT 4P | Inquiry |
 |
2967015 | Phoenix Contact | 14MM PLC BASIC TERM BLOCK 24V | Inquiry |
 |
1904045-3 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A010-EV-000 | Inquiry |
|
27E168 | TE Connectivity Potter & Brumfield Relays | SOCKET NYL 10A FOR KUP93 SER | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers