BYCHIPS is the stocking distributor for 23S09-1HDCG8, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 23S09-1HDCG8 by email, we will give you a best price according your plan.
Buy 23S09-1HDCG8 with BYCHPS
Buy with guarantee
23S09-1HDCG8
- Part Number:
- 23S09-1HDCG8
- Manufacturer:
- IDT (Integrated Device Technology)
- Description:
- IC CLK BUFF ZD HI DRV 16-SOIC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15527 Pieces
- Data sheet:
- 23S09-1HDCG8.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Zero Delay Buffer |
| Supplier Device Package: | 16-SOIC |
| Series: | - |
| Ratio - Input:Output: | 1:9 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-SOIC (0.154", 3.90mm Width) |
| PLL: | Yes with Bypass |
| Output: | CMOS, LVTTL |
| Other Names: | IDT23S09-1HDCG8 IDT23S09-1HDCG8-ND |
| Operating Temperature: | 0°C ~ 70°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | 23S09-1HDCG8 |
| Input: | LVTTL |
| Frequency - Max: | 133MHz |
| Divider/Multiplier: | No/No |
| Differential - Input:Output: | No/No |
| Description: | IC CLK BUFF ZD HI DRV 16-SOIC |
| Email: | [email protected] |
Related parts for 23S09-1HDCG8
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers