BYCHIPS is the stocking distributor for 1SV263-TL-E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 1SV263-TL-E by email, we will give you a best price according your plan.
Buy 1SV263-TL-E with BYCHPS
Buy with guarantee
1SV263-TL-E
- Part Number:
- 1SV263-TL-E
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- DIODE PIN 50V 50MA SGL MCP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19872 Pieces
- Data sheet:
- 1SV263-TL-E.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 50V |
|---|---|
| Supplier Device Package: | 3-MCP |
| Series: | - |
| Resistance @ If, F: | 4.5 Ohm @ 10mA, 100MHz |
| Power Dissipation (Max): | 100mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | SC-70, SOT-323 |
| Operating Temperature: | 125°C (TJ) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | 1SV263-TL-E |
| Expanded Description: | RF Diode PIN - Single 50V 50mA 100mW 3-MCP |
| Diode Type: | PIN - Single |
| Description: | DIODE PIN 50V 50MA SGL MCP |
| Current - Max: | 50mA |
| Capacitance @ Vr, F: | 0.4pF @ 50V, 1MHz |
| Email: | [email protected] |
Related parts for 1SV263-TL-E
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BAR 61 E6327 | Infineon Technologies | DIODE RF DUAL 100V 140M SOT-143 | Inquiry |
 |
CPINF5204-HF | Comchip Technology | DIODE PIN 180V 500MW SOD323 | Inquiry |
 |
UPP1004/TR13 | Microsemi Corporation | DIODE PIN 100V 2.5W POWERMITE | Inquiry |
 |
MA4FCP200 | M/A-Com Technology Solutions | DIODE PIN HMIC FLIPCHIP | Inquiry |
 |
HSCH-5531 | Broadcom Limited | DIODE SCHOTTKY PAIR 375V BEAM LD | Inquiry |
 |
1SV264-TL-E | ON Semiconductor | DIODE PIN 50V 50MA DUAL CP | Inquiry |
 |
1SV267-TB-E | ON Semiconductor | DIODE PIN 50V 50MA DUAL CP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers