BYCHIPS is the stocking distributor for 185MKP275KG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 185MKP275KG by email, we will give you a best price according your plan.
Buy 185MKP275KG with BYCHPS
Buy with guarantee
185MKP275KG
- Part Number:
- 185MKP275KG
- Manufacturer:
- Illinois Capacitor
- Description:
- CAP FILM 1.8UF 10% 310VAC RADIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12614 Pieces
- Data sheet:
- 185MKP275KG.pdf
Introduction
Specifications
| Voltage Rating - DC: | - |
|---|---|
| Voltage Rating - AC: | 310V |
| Tolerance: | ±10% |
| Termination: | PC Pins |
| Size / Dimension: | 1.024" L x 0.492" W (26.00mm x 12.50mm) |
| Series: | MKP |
| Packaging: | Bulk |
| Package / Case: | Radial |
| Operating Temperature: | -40°C ~ 110°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | 185MKP275KG |
| Lead Spacing: | 0.886" (22.50mm) |
| Height - Seated (Max): | 0.917" (23.30mm) |
| Features: | X2 Safety Rated |
| Expanded Description: | 1.8µF ±10% Film Capacitor 310V Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 1.8UF 10% 310VAC RADIAL |
| Capacitance: | 1.8µF |
| Applications: | EMI, RFI Suppression |
| Email: | [email protected] |
Related parts for 185MKP275KG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog