BYCHIPS is the stocking distributor for 170M8540, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 170M8540 by email, we will give you a best price according your plan.
Buy 170M8540 with BYCHPS
Buy with guarantee
170M8540
- Part Number:
- 170M8540
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSE 900A 1000V 3FKE/115 AR UR
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12849 Pieces
- Data sheet:
- 170M8540.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Packaging: | Bulk |
| Package / Case: | Rectangular, Blade |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | 170M8540 |
| Fuse Type: | Square |
| Description: | FUSE 900A 1000V 3FKE/115 AR UR |
| Email: | [email protected] |
Related parts for 170M8540
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
170M8547 | Eaton | FUSE 1250A 690V 3SHT AR UC | Inquiry |
|
170M8544 | Eaton | FUSE 1400A 900V 3FKE/115 AR | Inquiry |
|
170M8504 | Eaton | FUSE 500A 1000V 3GKN/75 AR UR | Inquiry |
|
170M8543 | Eaton | FUSE 1250A 1000V 3FKE/115 AR | Inquiry |
|
170M8557D | Eaton | FUSE 1600A 690V AR DIN 3 HSDNH | Inquiry |
|
170M8512 | Eaton | FUSE 1250A 1000V 3GKN/90 AR | Inquiry |
|
170M8539 | Eaton | FUSE 800A 1000V 3FKE/115 AR UR | Inquiry |
|
170M8542 | Eaton | FUSE 1100A 1000V 3FKE/115 AR UR | Inquiry |
|
170M8552 | Eaton | FUSE 1100A 690V 3SHT | Inquiry |
|
170M8506 | Eaton | FUSE 630A 1000V 3GKN/75 AR UR | Inquiry |
|
170M8545 | Eaton | FUSE 800A 690V 3SHT AR UC | Inquiry |
|
170M8550 | Eaton | FUSE 1600A 690V 3SHT AR UC | Inquiry |
|
170M8511 | Eaton | FUSE 1100A 1000V 3GKN/75 AR UR | Inquiry |
|
170M8554D | Eaton | FUSE 1250A 690V AR DIN 3 HSDNH | Inquiry |
|
170M8541 | Eaton | FUSE 1000A 1000V 3FKE/115 AR UR | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers