BYCHIPS is the stocking distributor for 170M6503, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 170M6503 by email, we will give you a best price according your plan.
Buy 170M6503 with BYCHPS
Buy with guarantee
170M6503
- Part Number:
- 170M6503
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSE 1400A 1100V 3SPKN/85 AR
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12100 Pieces
- Data sheet:
- 170M6503.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Packaging: | Bulk |
| Package / Case: | Rectangular, Blade |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | 170M6503 |
| Fuse Type: | Square |
| Description: | FUSE 1400A 1100V 3SPKN/85 AR |
| Email: | [email protected] |
Related parts for 170M6503
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
170M6500 | Eaton | FUSE SQUARE 1.25KA 1.3KVAC | Inquiry |
|
170M6547 | Eaton | FUSE SQUARE 900A 1.3KVAC | Inquiry |
|
170M6543 | Eaton | FUSE SQUARE 550A 1.3KVAC | Inquiry |
|
170M6508 | Eaton | FUSE SQUARE 500A 700VAC | Inquiry |
|
170M6595 | Eaton | FUSE SQUARE 700A 1.3KVAC | Inquiry |
|
170M6509 | Eaton | FUSE SQUARE 550A 700VAC | Inquiry |
|
170M6545 | Eaton | FUSE SQUARE 700A 1.3KVAC | Inquiry |
|
170M6541 | Eaton | FUSE SQUARE 450A 1.3KVAC | Inquiry |
 |
170M6524 | Eaton | FUSE 1100A 1000V 3BKN/80 AR | Inquiry |
|
170M6571 | Eaton | FUSE SQUARE 2KA 700VAC | Inquiry |
|
170M6548 | Eaton | FUSE SQUARE 1KA 1.3KVAC | Inquiry |
|
170M6538 | Eaton | FUSE SQUARE 315A 1.3KVAC | Inquiry |
|
170M6511 | Eaton | FUSE SQUARE 700A 700VAC | Inquiry |
|
170M6540 | Eaton | FUSE SQUARE 400A 1.3KVAC | Inquiry |
|
170M6513 | Eaton | FUSE SQUARE 900A 700VAC | Inquiry |
|
170M6560 | Eaton | FUSE SQUARE 630A 700VAC | Inquiry |
|
170M6597 | Eaton | FUSE SQUARE 900A 1.3KVAC | Inquiry |
|
170M6501 | Eaton | FUSE SQUARE 1.4KA 1.3KVAC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers