BYCHIPS is the stocking distributor for 170M3967, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 170M3967 by email, we will give you a best price according your plan.
Buy 170M3967 with BYCHPS
Buy with guarantee
170M3967
- Part Number:
- 170M3967
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSE 80A
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16237 Pieces
- Data sheet:
- 170M3967.pdf
Introduction
Specifications
| Size / Dimension: | 3.150" L x 1.693" W x 2.402" H (80.00mm x 43.00mm x 61.00mm) |
|---|---|
| Series: | * |
| Packaging: | Bulk |
| Package / Case: | Rectangular, Blade |
| Mounting Type: | Bolt Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 7 Weeks |
| Manufacturer Part Number: | 170M3967 |
| Fuse Type: | Square |
| Description: | FUSE 80A |
| Email: | [email protected] |
Related parts for 170M3967
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
170M3972 | Eaton | FUSE 250A 1000V | Inquiry |
|
170M3989 | Eaton | FUSE 315A 1000V | Inquiry |
|
170M3969 | Eaton | FUSE 125A 1000V | Inquiry |
|
170M3960 | Eaton | FUSE 350A | Inquiry |
|
170M3984 | Eaton | FUSE 100A 1000V | Inquiry |
|
170M3961 | Eaton | FUSE 400A | Inquiry |
|
170M3906 | Eaton | FUSE 315A | Inquiry |
|
170M3903 | Eaton | FUSE 160A | Inquiry |
|
170M3968 | Eaton | FUSE 100A | Inquiry |
|
170M3974 | Eaton | FUSE 350A 1000V | Inquiry |
|
170M3987 | Eaton | FUSE 200A 1000V | Inquiry |
|
170M3966 | Eaton | FUSE 63A | Inquiry |
|
170M3975 | Eaton | FUSE 400A 1000V | Inquiry |
|
170M3971 | Eaton | FUSE 200A 1000V | Inquiry |
|
170M3955 | Eaton | FUSE 125A | Inquiry |
|
170M3986 | Eaton | FUSE 160A 1000V | Inquiry |
|
170M3910 | Eaton | FUSE 500A | Inquiry |
|
170M3985 | Eaton | FUSE 125A 1000V | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers