BYCHIPS is the stocking distributor for 170M3471-G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 170M3471-G by email, we will give you a best price according your plan.
Buy 170M3471-G with BYCHPS
Buy with guarantee
170M3471-G
- Part Number:
- 170M3471-G
- Manufacturer:
- Bussmann (Eaton)
- Description:
- FUSE 550A 690V 1BKN/50 AR UC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12670 Pieces
- Data sheet:
- 170M3471-G.pdf
Introduction
Specifications
| Series: | * |
|---|---|
| Packaging: | Bulk |
| Package / Case: | Rectangular, Blade |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 4 Weeks |
| Manufacturer Part Number: | 170M3471-G |
| Fuse Type: | Square |
| Description: | FUSE 550A 690V 1BKN/50 AR UC |
| Email: | [email protected] |
Related parts for 170M3471-G
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
170M3438 | Eaton | FUSE SQUARE 50A 1.3KVAC | Inquiry |
|
170M3440 | Eaton | FUSE SQUARE 80A 1.3KVAC | Inquiry |
|
170M3445 | Eaton | FUSE SQUARE 250A 1.3KVAC | Inquiry |
|
170M3413 | Eaton | FUSE SQUARE 125A 700VAC | Inquiry |
 |
170M3415/EV | Eaton | FUSE 200A 690V 1BN/50 AR UC | Inquiry |
|
170M3470 | Eaton | FUSE SQUARE 450A 700VAC | Inquiry |
|
170M3471 | Eaton | FUSE SQUARE 500A 700VAC | Inquiry |
|
170M3418 | Eaton | FUSE SQUARE 350A 700VAC | Inquiry |
|
170M3459 | Eaton | FUSE SQUARE 50A 700VAC | Inquiry |
|
170M3416 | Eaton | FUSE SQUARE 250A 700VAC | Inquiry |
|
170M3420 | Eaton | FUSE SQUARE 450A 700VAC | Inquiry |
|
170M3472 | Eaton | FUSE SQUARE 550A 700VAC | Inquiry |
|
170M3465 | Eaton | FUSE SQUARE 200A 700VAC | Inquiry |
|
170M3461 | Eaton | FUSE SQUARE 80A 700VAC | Inquiry |
|
170M3473 | Eaton | FUSE SQUARE 630A 700VAC | Inquiry |
|
170M3462 | Eaton | FUSE SQUARE 100A 700VAC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers