BYCHIPS is the stocking distributor for 163.7010.0502, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 163.7010.0502 by email, we will give you a best price according your plan.
Buy 163.7010.0502 with BYCHPS
Buy with guarantee
163.7010.0502
- Part Number:
- 163.7010.0502
- Manufacturer:
- Littelfuse
- Description:
- RES BLADE ATO 9.1K OHM 1% 0.4W
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14105 Pieces
- Data sheet:
- 163.7010.0502.pdf
Introduction
Specifications
| Type: | Blade, ATO |
|---|---|
| Tolerance: | ±1% |
| Temperature Coefficient: | - |
| Series: | FKS ATO® |
| Resistance (Ohms): | 9.1k |
| Power (Watts): | 0.4W |
| Packaging: | Bulk |
| Other Names: | 163.7010.0502-ND F6798 |
| Operating Temperature: | - |
| Mounting Type: | Holder |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 163.7010.0502 |
| Expanded Description: | 9.1k Ohm ±1% 0.4W Blade, ATO Specialized Resistor Metal Element Holder |
| Description: | RES BLADE ATO 9.1K OHM 1% 0.4W |
| Composition: | Metal Element |
| Applications: | Automotive |
| Email: | [email protected] |
Related parts for 163.7010.0502
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
163.7010.0102 | Littelfuse Inc. | RES BLADE ATO 110 OHM 1% 0.4W | Inquiry |
|
163.7010.0252 | Littelfuse Inc. | RES BLADE ATO 680 OHM 1% 0.4W | Inquiry |
|
163.7010.0052 | Littelfuse Inc. | RES BLADE ATO 62 OHM 1% 0.4W | Inquiry |
|
163.7010.0352 | Littelfuse Inc. | RES BLADE ATO 1.5K OHM 1% 0.4W | Inquiry |
|
163.7010.0202 | Littelfuse Inc. | RES BLADE ATO 430 OHM 1% 0.4W | Inquiry |
 |
163.7010.0452 | Littelfuse Inc. | RES BLADE ATO 3.9K OHM 1% 0.4W | Inquiry |
|
163.7010.0402 | Littelfuse Inc. | RES BLADE ATO 2.4K OHM 1% 0.4W | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers