BYCHIPS is the stocking distributor for 15723C200, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 15723C200 by email, we will give you a best price according your plan.
Buy 15723C200 with BYCHPS
Buy with guarantee
15723C200
- Part Number:
- 15723C200
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE 3PDT 10A 24V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14678 Pieces
- Data sheet:
- 15723C200.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 18 VDC |
|---|---|
| Turn Off Voltage (Min): | - |
| Termination Style: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Switching Voltage: | 240VAC, 28VDC - Max |
| Series: | 157, CII |
| Release Time: | 10ms |
| Relay Type: | General Purpose |
| Packaging: | Tray |
| Other Names: | 157-23C200 157-23C200-ND 3-1608052-1 3-1608052-1-ND 316080521 PB1415 |
| Operating Temperature: | -45°C ~ 70°C |
| Operate Time: | 20ms |
| Mounting Type: | Socketable |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 15723C200 |
| Features: | - |
| Expanded Description: | General Purpose Relay 3PDT (3 Form C) 24VDC Coil Socketable |
| Description: | RELAY GEN PURPOSE 3PDT 10A 24V |
| Contact Rating (Current): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Voltage: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 470 Ohms |
| Coil Power: | 1.2 W |
| Email: | [email protected] |
Related parts for 15723C200
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers