BYCHIPS is the stocking distributor for 128KBM063MLAG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 128KBM063MLAG by email, we will give you a best price according your plan.
Buy 128KBM063MLAG with BYCHPS
Buy with guarantee
128KBM063MLAG
- Part Number:
- 128KBM063MLAG
- Manufacturer:
- Illinois Capacitor
- Description:
- CAP ALUM 1200UF 20% 63V T/H
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16030 Pieces
- Data sheet:
- 128KBM063MLAG.pdf
Introduction
Specifications
| Voltage Rating: | 63V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.709" Dia (18.00mm) |
| Series: | KBM |
| Ripple Current: | 1.56A |
| Polarization: | Polar |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -40°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | 128KBM063MLAG |
| Lifetime @ Temp.: | 10000 Hrs @ 105°C |
| Lead Spacing: | 0.295" (7.50mm) |
| Impedance: | 30 mOhm |
| Height - Seated (Max): | 1.260" (32.00mm) |
| Expanded Description: | 1200µF 63V Aluminum Capacitors Radial, Can 152 mOhm @ 120Hz 10000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 152 mOhm @ 120Hz |
| Description: | CAP ALUM 1200UF 20% 63V T/H |
| Capacitance: | 1200µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for 128KBM063MLAG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog