BYCHIPS is the stocking distributor for 1-1608052-2, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 1-1608052-2 by email, we will give you a best price according your plan.
Buy 1-1608052-2 with BYCHPS
Buy with guarantee
1-1608052-2
- Part Number:
- 1-1608052-2
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE 3PDT 10A 12V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS Compliant
- Available Quantity:
- 15998 Pieces
- Data sheet:
- 1-1608052-2.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 9 VDC |
|---|---|
| Turn Off Voltage (Min): | - |
| Termination Style: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Switching Voltage: | 240VAC, 28VDC - Max |
| Series: | 157, CII |
| Release Time: | 10ms |
| Relay Type: | General Purpose |
| Packaging: | Tray |
| Other Names: | 1-1608052-2-ND 116080522 157-23B200=R2955 PB1966 |
| Operating Temperature: | -45°C ~ 70°C |
| Operate Time: | 20ms |
| Mounting Type: | Socketable |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | 1-1608052-2 |
| Features: | - |
| Expanded Description: | General Purpose Relay 3PDT (3 Form C) 12VDC Coil Socketable |
| Description: | RELAY GEN PURPOSE 3PDT 10A 12V |
| Contact Rating (Current): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Voltage: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 120 Ohms |
| Coil Power: | 1.2 W |
| Email: | [email protected] |
Related parts for 1-1608052-2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers