BYCHIPS is the stocking distributor for 06031J3R3BAWTR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for 06031J3R3BAWTR by email, we will give you a best price according your plan.
Buy 06031J3R3BAWTR with BYCHPS
Buy with guarantee
06031J3R3BAWTR
- Part Number:
- 06031J3R3BAWTR
- Manufacturer:
- AVX Corporation
- Description:
- CAP THIN FILM 3.3PF 100V 0603
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14666 Pieces
- Data sheet:
- 06031J3R3BAWTR.pdf
Introduction
Specifications
| Voltage - Rated: | 100V |
|---|---|
| Tolerance: | ±0.1pF |
| Size / Dimension: | 0.063" L x 0.032" W (1.60mm x 0.81mm) |
| Series: | Accu-F® |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0603 (1608 Metric) |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | 06031J3R3BAWTR |
| Height - Seated (Max): | 0.029" (0.73mm) |
| Features: | RF, High Q, Low Loss |
| Expanded Description: | 3.3pF ±0.1pF Thin Film Capacitor 100V 0603 (1608 Metric) |
| Description: | CAP THIN FILM 3.3PF 100V 0603 |
| Capacitance: | 3.3pF |
| Email: | [email protected] |
Related parts for 06031J3R3BAWTR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers