Specifically, its semiconductor manufacturing site in Grenoble, France, is the first in Europe to receive MIL-PRF-38535 Class Y aerospace certification, awarded by the USA’s Defense Logistics Agency (DLA).

This is recognised as the highest guarantee of quality and reliability for ceramic, non-hermetically sealed Flip-Chip microcircuits (pictured) for aerospace and defense applications, says Teledyne.

It is the third site in the world to be recognised by the DLA for this class.

As well as QML Class Y, Teledyne e2v has been awarded QML Class V for its ceramic, hermetically sealed Flip-Chip microcircuits.

“Being awarded QML Class Y is a huge reward for the efforts and investment made by the entire team at our Grenoble site,” said Laurent Monge, President of Semiconductors and General Manager of Teledyne e2v’s Grenoble site. “It is a symbol of the standards we judge ourselves against when developing and packaging world leading digital and signal processing solutions.”

The certification coincides with Teledyne e2v announcing the availability of its Industrialisation and Manufacturing Services, for semiconductor packaging solutions.

“The addition of QML certification for non-hermetically sealed solutions means we can now serve customers requiring any type of semiconductor space package, including Flip-Chip, Wire Bond, Ceramic and Plastic, hermetically or non-hermetically sealed,” added Evelyne Tur, Vice President of Operations and Manufacturing Services at Teledyne e2v.

Teledyne e2v is already certified to QML Classes Q and V for wire bonded devices. The new Grenoble certification plays into the company’s plans to qualify its latest space grade solutions to QML Class Y.