The AEC-Q101 Trench 9, 40 V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D²PAK or D²PAK-7 devices.

The 0.9 mΩ, 220 A DC-rated BUK9J0R9-40H  MOSFET suits applications up to 1.2 kW, and is also lower cost than larger D²PAK devices which were the previous best solution.

As well as reducing R_DS(on) the new devices also feature an improved DC current rating of 220 A – a first for the automotive Power-SO8 footprint. This enables higher power density on a small footprint, which is especially valuable for safety-critical automotive applications that require dual redundant circuitry.

The use of Superjunction technology delivers a higher Avalanche capability and Safe Operating Area for improved performance under fault conditions.

“Nexperia is the only company with a low voltage Superjunction MOSFET platform,”says Nexperia’s Norman Stapelberg.

LFPAK56 Trench 9 MOSFETs facilitate paralleling for high current applications. Devices suit automotive functions such as motor control (brushed and brushless) for power steering, transmission control, ABS, ESC, pumps (water, oil and fuel), fan speed control, reverse battery protection and DC/DC converters.