BYCHIPS is the stocking distributor for Z16C3010VEG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for Z16C3010VEG by email, we will give you a best price according your plan.
Buy Z16C3010VEG with BYCHPS
Buy with guarantee
Z16C3010VEG
- Part Number:
- Z16C3010VEG
- Manufacturer:
- Zilog
- Description:
- IC 10MHZ CMOS USC XTEMP 68-PLCC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14128 Pieces
- Data sheet:
- 1.Z16C3010VEG.pdf2.Z16C3010VEG.pdf
Introduction
Specifications
| Voltage - Supply: | 4.75 V ~ 5.5 V |
|---|---|
| Supplier Device Package: | 68-PLCC |
| Series: | USC® |
| Packaging: | Tube |
| Package / Case: | 68-LCC (J-Lead) |
| Other Names: | 269-4688-5 Z16C3010VEG-ND |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | Z16C3010VEG |
| Interface: | - |
| Expanded Description: | Interface 68-PLCC |
| Description: | IC 10MHZ CMOS USC XTEMP 68-PLCC |
| Applications: | - |
| Email: | [email protected] |
Related parts for Z16C3010VEG
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
Z16C3010AEC00TR | Zilog | IC Z16C30 MCU USC 100VQFP | Inquiry |
|
Z16C3010ASC00TR | Zilog | IC Z16C30 MCU USC 100VQFP | Inquiry |
 |
Z16C3010VEC00TR | Zilog | IC Z16C30 MCU USC 68PLCC | Inquiry |
|
Z16C3010VEC | Zilog | IC 10MHZ CMOS USC XTEMP 68-PLCC | Inquiry |
|
Z16C3010AEC | Zilog | IC 10MHZ CMOS USC 100-VQFP | Inquiry |
|
Z16C3010AEG | Zilog | IC 10MHZ CMOS USC 100-VQFP | Inquiry |
|
Z16C3010ASG | Zilog | IC 10MHZ CMOS USC 100-VQFP | Inquiry |
|
Z16C3010VSC | Zilog | IC 10MHZ CMOS USC 68-PLCC | Inquiry |
|
Z16C3010VSC00TR | Zilog | IC Z16C32 MCU USC 68PLCC | Inquiry |
|
Z16C3010ASC | Zilog | IC 10MHZ CMOS USC 100-VQFP | Inquiry |
|
Z16C3010VSG | Zilog | IC 10MHZ CMOS USC 68-PLCC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers