BYCHIPS is the stocking distributor for XHRA-2HPA-TQ64-C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XHRA-2HPA-TQ64-C by email, we will give you a best price according your plan.
Buy XHRA-2HPA-TQ64-C with BYCHPS
Buy with guarantee
XHRA-2HPA-TQ64-C
- Part Number:
- XHRA-2HPA-TQ64-C
- Manufacturer:
- XMOS
- Description:
- IC AUDIO PROCESSOR 2CH 64TQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18830 Pieces
- Data sheet:
- 1.XHRA-2HPA-TQ64-C.pdf2.XHRA-2HPA-TQ64-C.pdf
Introduction
Specifications
| Voltage - Supply: | 3.3V |
|---|---|
| Supplier Device Package: | 64-TQFP (10x10) |
| Specifications: | USB |
| Series: | - |
| Packaging: | Tray |
| Package / Case: | 64-TQFP Exposed Pad |
| Other Names: | 880-1114 XHRA-2HPA-TQ64-C-ND |
| Operating Temperature: | 0°C ~ 70°C (TA) |
| Number of Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | XHRA-2HPA-TQ64-C |
| Interface: | I²C, I²S |
| Function: | Audio Signal Processor |
| Expanded Description: | Audio Audio Signal Processor 2 Channel 64-TQFP (10x10) |
| Description: | IC AUDIO PROCESSOR 2CH 64TQFP |
| Applications: | Audio Systems |
| Email: | [email protected] |
Related parts for XHRA-2HPA-TQ64-C
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAX4397DACTM+T | Maxim Integrated | IC SW A/V SCART CON 48-TQFN | Inquiry |
 |
LC82360-YJ2-E | ON Semiconductor | IC SILICON AUDIO 80SQFP | Inquiry |
 |
TAS3103IDBT | Texas Instruments | IC DGTL AUDIO PROC 38-TSSOP | Inquiry |
 |
BD3805F-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SCF 22SOP | Inquiry |
 |
TEA6321T/V1,518 | NXP USA Inc. | IC SOUND FADER CONTROL 32SO | Inquiry |
|
TAS5518CPAG | Texas Instruments | IC PWM PROC 8CH DIG AUDIO 64TQFP | Inquiry |
|
TAS5036AIPFCG4 | Texas Instruments | IC PWM PROC DGTL AUD 6CH 80-TQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers