BYCHIPS is the stocking distributor for W681360YG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for W681360YG by email, we will give you a best price according your plan.
Buy W681360YG with BYCHPS
Buy with guarantee
W681360YG
- Part Number:
- W681360YG
- Manufacturer:
- Nuvoton Technology Corporation America
- Description:
- IC VOICEBAND CODEC 3V 32-QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17101 Pieces
- Data sheet:
- W681360YG.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 2.7 V ~ 5.25 V |
|---|---|
| Voltage - Supply, Analog: | 2.7 V ~ 5.25 V |
| Type: | PCM |
| Supplier Device Package: | 32-QFN (5.2x5.2) |
| Sigma Delta: | No |
| Series: | - |
| S/N Ratio, ADCs / DACs (db) Typ: | - |
| Resolution (Bits): | 13 b |
| Packaging: | Tray |
| Package / Case: | 32-VFQFN |
| Operating Temperature: | -40°C ~ 85°C |
| Number of ADCs / DACs: | 1 / 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | W681360YG |
| Expanded Description: | PCM Interface 13 b PCM Audio Interface 32-QFN (5.2x5.2) |
| Dynamic Range, ADCs / DACs (db) Typ: | - |
| Description: | IC VOICEBAND CODEC 3V 32-QFN |
| Data Interface: | PCM Audio Interface |
| Email: | [email protected] |
Related parts for W681360YG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers